OmniTier, founded in 2015, is a multidisciplinary team of developers, bioinformaticians, and memory storage engineers, committed to big data challenges, especially in the life sciences. Our founding team was instrumental in developing many of the flash memory technologies widely used today. Our passion is utilizing this memory technology in creating customized, accelerated software solutions for genomics, web caching, and machine learning analytics. The company has offices in Milpitas, California and Rochester, Minnesota.
OmniTier is here to transform data-intensive applications by harnessing the power of flexible and efficient tiered-memory architectures
OmniTier products will turn servers into supercomputers for prescribed applications, at a fraction of the cost, and deliver those products with the best customer support.
OmniTier’s quality, cost, performance, and customer service will be second to none in the marketplace.
Hemant Thapar is the Chairman, CEO, and Co-founder of OmniTier. Hemant previously founded and led two successful startups, DataPath Systems and Link_A_Media Devices, which were acquired by LSI Corporation and SK Hynix, respectively. Together, Link_A_Media Devices and DataPath Systems delivered many “industry firsts” in data recovery technologies, SoCs, and Controllers for data storage, contributing to the shipment of hundreds of millions of chips for HDDs and SSDs.
During his early career, Hemant held various technical and management positions at the Bell Telephone Laboratories, Holmdel and the IBM Corporation, San Jose, where he made pioneering contributions in the areas of circuit-switched networking, data communications, and data storage. He made fundamental contributions to traffic modeling and network design optimization for AT&T’s Dynamic Non-Hierarchical Routing (DNHR) networking, introduced in 1984, that marked a fundamental change to its network architecture in 50 years. He was one of the early contributors to the adoption of Trellis-Coded Modulation, leading to the establishing of the CCITT V.32 standard for voiceband data modems. His work on Extended Partial Response Systems (EPR) and associated coding methods became the de facto industry standard for data recovery in disk drive and tape drive products.
Hemant is a member of the National Academy of Engineering, an IEEE Fellow, and a recipient of the Distinguished Alumni Award from Santa Clara University. He is co-recipient of three best paper awards for his work on high-speed data transmission and high-density data storage. He served as a guest editor of two special issues of the IEEE Transactions on Selected Areas in Communications devoted to data storage technologies.
Hemant serves on the Board of Directors of Assia Corporation, a private company enabling next-generation broadband technology and products; and on the Advisory Boards of the School of Engineering, Santa Clara University and the Ambala College of Engineering and Applied Sciences (India). He was a part-time Adjunct Lecturer in Electrical Engineering at Santa Clara University from 1984 to 2004 and a Visiting Research Scientist at UCSD from October 2013 to June 2014.
Hemant holds the B.S (EECS) from Santa Clara University and the M.S and Ph. D. degrees in Electrical Engineering from Purdue University.
Jonathan Coker is the CTO of OmniTier Inc. He joined the company in September 2015, shortly after it was founded.
Jon has a proven track record of transforming advanced research activity into industry-first technical innovations. Shortly after joining IBM in 1985, he lead advanced integration activities, bringing the first magnetoresistive heads, thin film disks, and advanced data channels to the hard drive market. Upon leaving IBM in 2001, he was IBM’s lead signal processing architect. At Mayo Clinic’s research division, Jon managed the electrical engineering research team, architecting and implementing the world’s fastest low-power ADC converters, long-range 40Gb SERDES links on copper, and specialized digital radar components, for DoD applications. After returning to the storage industry in 2008, he was named HGST Fellow. He became HGST’s Chief Architect, responsible for research and development in system-wide innovations such as advanced servo techniques, Cold Storage (CS) technologies, Shingled Magnetic Recording (SMR) and Two-Dimensional Magnetic Recording (TDMR).
Jon is a commonly-invited speaker throughout academia, industry, and customer-related meetings. Recently, he was selected as a 2014 IEEE Distinguished Lecturer, a global honor reserved for the most effective technical communicators in the business. He gave a series of 40 lectures on the state of the art in storage, throughout Europe, the Americas, Asia, and Australia.
Jon’s contributions to a company’s value includes significant activities in formal publications, contributing to the state of the art while protecting the company’s value. He holds 68 granted patents in the US alone, in areas such as magnetic recording, signal processing, coding, digital radar, algorithms, and medical devices. He is co-author of 24 journals and conference papers.
Dr. Coker holds a liberal arts degree (B.A.) from Wheaton College; a B.S. in Electrical Engineering from the University of Minnesota in 1985; a Master’s degree in Electrical Engineering and Mathematics from the University of Minnesota in 2006; and a Ph. D. degree in Electrical Engineering and Mathematics, in 2008, also from the University of Minnesota.
Suneel Indupuru is co-founder and Vice president of Software Engineering at OmniTier Inc.
Suneel brings 15 years of experience in development of high performance compute and storage solutions. Prior to joining OmniTier Inc, Suneel was Senior Director of SSD Firmware engineering at SK Hynix Memory Solutions, where he led the development of enterprise SSD products. Prior to that, Suneel worked at Transmeta and Philips Semiconductors, where he developed low power, high performance microprocessors based on VLIW architectures.
Suneel holds a Masters degree from Indian Institute of Technology, Delhi and a MBA from University of California, Davis.